Varuna Subsystems: Mechanical & Thermal

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Tests Conducted

Thermo-Vacuum Test

Shock Test

Vibration Test

Sine-Burst Test

Active Thermal Test

Honor Roll

Tanmay Singhal

Akash Pandya

Mahesh Damor

Deep Karia

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Mentors

Jonathan Sauder (NASA-JPL)

Shri HR Kansara (SAC, ISRO)

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Institutes

IIMA Ventures

IN-SPACe

ATIRA

The mechanical and thermal subsystem takes on significant structural and protective roles. Its primary functions include:

Optimizing communication with mission control by securely stowing and deploying the Reflect Array Antenna. It prevents the antenna from being jolted out of place due to launch forces or deploying before time in space.

Protecting all seven subsystems with enclosures strong enough to withstand powerful launch forces — 1500g of shock in each axis.

Dissipating heat from all electronic components to prevent overheating in space.

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Note: Heat doesn’t naturally dissipate in space, as on Earth. This is because space is nearly a complete vacuum. There is no medium like air or water for heat to dissipate naturally via convection or conduction.

Varuna undergoing a Vibration Test for Mechanical Integrity

Construction

Varuna’s mechanical and thermal subsystems are built with material specifically designed to adapt to the harsh conditions of space.

All mechanical packages containing electric heat-generating systems are black anodized for high emissivity. This is done to maximize heat radiation from the hardware to space.

PEEK material is used to isolate each system from other heat-generating payloads on the testing deck. This ensures that no heat can be transferred from the POEM deck to any of Varuna’s subsystems.

Conversely, Heat Transfer Optimization techniques are used to improve heat transfers within the system. Our engineers create an origami design-based copper strap with a double stack. The strap contributes to efficient heat transfer from all components.

The outer cuboid is made using a monolithic structure that helps to enhance heat transfer between systems.

Thermal interface materials have been applied to the electronic components to help transfer heat generated from the PCB to the mechanical enclosure.

Our engineers concluded from the gamut of tests outlined above that the design material and workmanship met the stringent requirements of space launch and explanation. We were confident that the given payload would survive the environmental loads encountered during the launch.